Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> |
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| .. | ||
| dwc3-exynos.h | ||
| dwc3-omap.h | ||
| exynos4_tmu.h | ||
| fsa9480.h | ||
| leds-renesas-tpu.h | ||
| macb.h | ||
| msm_serial_hs.h | ||
| mv_usb.h | ||
| ntc_thermistor.h | ||
| pxa_sdhci.h | ||
| s3c-hsudc.h | ||
| tegra_usb.h | ||
| uio_pruss.h | ||